Tous les résultats (1 139)

Ordinateurs sur module - COM COM-HPC Mini module based on Intel Core i7-1365URE processor with 2 P-cores 1.7GHz up to 4.9GHz Turbo and 8 E-cores 1.2GHz up to 3.7GHz Turbo 12MB Intel Smart Cache Intel Iris Xe Graphics architecture with 96 EUs 32GB onboard LPDDR5x memor

Dissipateurs HSP COMe-mAL10 E2 slim thread

Dissipateurs Standard passive cooling for Qseven module conga-QA3. All stand-offs are M2.5 threaded.

Ordinateurs sur module - COM COM Express Type 6 Compact module with Intel Celeron 3955U dual core processor with 2.0GHz, 2MB L2 cache, 2133MT/s dual channel DDR4 memory interface

Ordinateurs sur module - COM COM Express Type 6 Compact module with Intel Core i3-7100U dual core processor with 2.4GHz, 3MB Intel Smart Cache , GT2 graphics and 2133MT/s dual channel DDR4 memory interface (Intel Kaby Lake-U).

Ordinateurs sur module - COM JUMPtec COMe mini Passive Uni Cooler (w/o HSP)

Dissipateurs Standard heatspreader (Heatstack Solution) for Qseven module conga-QMX6 with CPU in NON-LIDDED FCBGA Package.Threaded version (standoffs, M2.5)Intended for following QMX6 modules: * conga-QMX6/DC-1G eMMC4 (P/N 016102A) * conga-QMX6/QC-1G eMMC4 (P/N 0

Ordinateurs sur module - COM COM Express Type 6 Basic module based on AMD embedded R-Series R1606G 2-core processor with 2.6 GHz up to 3.5 GHz turbo boost, 1MB L2 Cache and dual channel DDR4 2400MT/s memory interface (formerly Great Horned Owl). Features AMD Radeon Vega integr

Refroidisseurs CPU et puce COMe Active Uni Cooler (w/o HSP)

Ordinateurs sur module - COM JUMPtec COMe Mount Kit 8mm 1set

Dissipateurs Standard Heatspreader for SMARC 2.0 module conga-SA5* For modules with IHS Intel Atom CPU* All stand-offs are bore hole 2.7mm

Refroidisseurs CPU et puce Passive cooling solution for SMARC module conga-SMX8-Plus with NXP i.MX 8M Plus ARM processor. All standoffs are with 2.7mm bore hole.