TS391 No-Clean Solder Paste

Chip Quik TS391 No-Clean Solder Paste is a dispense grade, synthetic paste with no refrigeration required to maintain shelf life. The no-clean solder paste provides excellent wetting compatibility on most board finishes, exhibiting a wide process window with low voiding and long stencil life. Chip Quik TS391 solder paste leaves a clear residue and supports printing speeds up to 125mm/sec. This solder paste is available with three different alloy compositions, each with different melting points, in 15g, 35g, 50g, 250g, and 500g packaging. The RoHS II and REACH compliant paste features a T4 mesh size, 20µm to 38µm range, and a ROL0 flux classification.

Résultats: 15
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Description Fiche technique Disponibilité Prix (EUR) Filtrer les résultats dans le tableau par prix unitaire basé sur votre quantité.
Qté. RoHS Produit
Type
Alliage
Type de package
Chip Quik Brasure Paste No-Clean 15g Sn63/Pb37 T4
Fiche technique
212En stock
25525/02/2026 attendu
Min. : 1
Mult. : 1
Solder Paste Tin/Lead, No Clean, Thermally Stable Sn63/Pb37 Syringe
Chip Quik Brasure Paste No-Clean 35g Sn63/Pb37 T4
Fiche technique
134En stock
Min. : 1
Mult. : 1
Solder Paste Tin/Lead, No Clean, Thermally Stable Sn63/Pb37 Syringe
Chip Quik Brasure Paste No-Clean 250g Sn63/Pb37 T4
Fiche technique
36En stock
4105/03/2026 attendu
Min. : 1
Mult. : 1
Solder Paste Tin/Lead, No Clean, Thermally Stable Sn63/Pb37 Jar
Chip Quik Brasure Paste No-Clean 50g Sn63/Pb37 T4
Fiche technique
148En stock
24716/02/2026 attendu
Min. : 1
Mult. : 1
Solder Paste Tin/Lead, No Clean, Thermally Stable Sn63/Pb37 Jar
Chip Quik Brasure Paste NoClean 15g Sn42/Bi57.6/Ag0.4 T4
Fiche technique
261En stock
Min. : 1
Mult. : 1

Solder Paste Lead Free, No Clean, Thermally Stable Sn42/Bi57.6/Ag0.4 Syringe
Chip Quik Brasure Paste NoClean 35g Sn42/Bi57.6/Ag0.4 T4
Fiche technique
93En stock
Min. : 1
Mult. : 1

Solder Paste Lead Free, No Clean, Thermally Stable Sn42/Bi57.6/Ag0.4 Syringe
Chip Quik Brasure Paste NoClean 250g Sn42/Bi57.6/Ag0.4 T4
Fiche technique
45En stock
Min. : 1
Mult. : 1

Solder Paste Lead Free, No Clean, Thermally Stable Sn42/Bi57.6/Ag0.4 Jar
Chip Quik Brasure Paste NoClean 15g T4 Sn96.5/Ag3.0/Cu0.5
Fiche technique
207En stock
Min. : 1
Mult. : 1

Solder Paste Lead Free, No Clean, Thermally Stable Sn96.5/Ag03/Cu0.5 Syringe
Chip Quik Brasure Paste NoClean 35g T4 Sn96.5/Ag3.0/Cu0.5
Fiche technique
93En stock
Min. : 1
Mult. : 1

Solder Paste Lead Free, No Clean, Thermally Stable Sn96.5/Ag03/Cu0.5 Syringe
Chip Quik Brasure Paste NoCln 250g T4 Sn96.5/Ag3.0/Cu0.5
Fiche technique
65En stock
16702/03/2026 attendu
Min. : 1
Mult. : 1

Solder Paste Lead Free, No Clean, Thermally Stable Sn96.5/Ag03/Cu0.5 Jar
Chip Quik Brasure Paste NoClean 50g T4 Sn96.5/Ag3.0/Cu0.5
Fiche technique
272En stock
Min. : 1
Mult. : 1

Solder Paste Lead Free, No Clean, Thermally Stable Sn96.5/Ag03/Cu0.5 Jar
Chip Quik Brasure Paste No-Clean 500g Sn63/Pb37 T4
Fiche technique
9En stock
Min. : 1
Mult. : 1
Solder Paste Tin/Lead, No Clean, Thermally Stable Sn63/Pb37 Cartridge
Chip Quik Brasure Paste No-Clean 50g Sn42/Bi57.6/Ag0.4 T4
Fiche technique
57En stock
10423/02/2026 attendu
Min. : 1
Mult. : 1

Solder Paste Lead Free, No Clean, Thermally Stable Sn42/Bi57.6/Ag0.4 Jar
Chip Quik Brasure Paste No-Clean 500g Sn42/Bi57.6/Ag0.4 T4
Fiche technique
Délai de livraison produit non stocké 6 Semaines
Min. : 1
Mult. : 1

Solder Paste Lead Free, No Clean, Thermally Stable Sn42/Bi57.6/Ag0.4 Cartridge
Chip Quik Brasure Paste NoCln 500g T4 Sn96.5/Ag3.0/Cu0.5
Fiche technique
N/A
Min. : 1
Mult. : 1

Solder Paste Lead Free, No Clean, Thermally Stable Sn96.5/Ag03/Cu0.5 Cartridge