xGM260P Wireless Modules

Silicon Labs xGM260P Wireless Modules are 2.4GHz frequency devices that deliver excellent RF performance. The MGM260P modules are based on the EFR32MG26 System-on-Chips (SoCs) and support Bluetooth®, Zigbee®, Thread, and Matter protocols. These MGM260P modules feature Secure Vault® technology and support various advanced debugging and development tools. The BGM260P modules are based on the EFR32BG26 SoCs and support Bluetooth Low Energy (BLE) and Bluetooth mesh. These xGM260P wireless modules are ideal for use in light bulbs and designs that require extra PCB layout flexibility.

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Qty. RoHS ECAD Model Series
Frequency
Output Power
Interface Type
Supply Voltage - Min
Supply Voltage - Max
Minimum Operating Temperature
Maximum Operating Temperature
Dimensions
Protocol - Bluetooth, BLE - 802.15.1
Protocol - ANT, Thread, Zigbee - 802.15.4
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Silicon Labs Multiprotocol Modules 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module
Datasheet
62In Stock
Min.: 1
Mult.: 1

MGM260P 2.4 GHz 10 dBm ADC, GPIO, I2C, I2S, IrDA, JTAG, SPI, UART, USART 1.8 V 3.8 V - 40 C + 125 C 12.9 mm x 15 mm Bluetooth, BLE Thread, Zigbee - 802.15.4 Multiprotocol Wireless Module Cut Tape
Silicon Labs Multiprotocol Modules 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module
Datasheet
177In Stock
Min.: 1
Mult.: 1

MGM260P 2.4 GHz 20 dBm ADC, GPIO, I2C, I2S, IrDA, JTAG, SPI, UART, USART 1.8 V 3.8 V - 40 C + 125 C 12.9 mm x 15 mm Bluetooth, BLE Thread, Zigbee - 802.15.4 Multiprotocol Wireless Module Cut Tape
Silicon Labs Multiprotocol Modules 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module
Datasheet
110In Stock
Min.: 1
Mult.: 1

MGM260P 2.4 GHz 20 dBm ADC, GPIO, I2C, I2S, IrDA, JTAG, SPI, UART, USART 1.8 V 3.8 V - 40 C + 125 C 12.9 mm x 15 mm Bluetooth, BLE Thread, Zigbee - 802.15.4 Multiprotocol Wireless Module Cut Tape
Silicon Labs Multiprotocol Modules 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module
Datasheet
63In Stock
Min.: 1
Mult.: 1

MGM260P 2.4 GHz 10 dBm ADC, GPIO, I2C, I2S, IrDA, JTAG, SPI, UART, USART 1.8 V 3.8 V - 40 C + 125 C 12.9 mm x 15 mm Bluetooth, BLE Thread, Zigbee - 802.15.4 Multiprotocol Wireless Module Cut Tape
Silicon Labs Multiprotocol Modules 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module
Datasheet
144In Stock
Min.: 1
Mult.: 1

MGM260P 2.4 GHz 20 dBm ADC, GPIO, I2C, I2S, IrDA, JTAG, SPI, UART, USART 1.8 V 3.8 V - 40 C + 125 C 12.9 mm x 15 mm Bluetooth, BLE Thread, Zigbee - 802.15.4 Multiprotocol Wireless Module Cut Tape
Silicon Labs Multiprotocol Modules 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module
Datasheet
23In Stock
Min.: 1
Mult.: 1

MGM260P 2.4 GHz 20 dBm ADC, GPIO, I2C, I2S, IrDA, JTAG, SPI, UART, USART 1.8 V 3.8 V - 40 C + 125 C 12.9 mm x 15 mm Bluetooth, BLE Thread, Zigbee - 802.15.4 Multiprotocol Wireless Module Cut Tape