Nouveauté Outils et fournitures

Chip Quik Sn95.5/Ag4.0/Cu0.5 Solder Spheres for BGAs are manufactured from virgin materials to meet or exceed the requirements of building or repairing BGA packages. These solder spheres also exceed MIL standards and IPC for size tolerances and purity levels. The Sn95.5/Ag4.0/Cu0.5 solder spheres are available in nominal sizes from 0.20mm to 0.76mm (8mil to 30mil). These solder spheres are Lead-free and REACH-compliant. The Sn95.5/Ag4.0/Cu0.5 solder spheres are compliant with RoHS 3, REACH, and conflict minerals. These solder spheres operate at 217°C (423°F) melting point and are available in up to 0.60mm sphere diameter.
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Chip Quik Sn95.5/Ag4.0/Cu0.5 Solder Spheres for BGAsManufactured from virgin materials to meet or exceed the requirements of a building.06/09/2023
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Chip Quik Indium Solder Ribbon (In52/Sn48)Features 11.9N/mm2 (at 20°C) tensile strength and 118°C (244°F) melting point.05/09/2023
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Chip Quik 2.5mm Solder Wick - No CleanRemoves excess solder and solder bridges/short circuits between pins.05/09/2023
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M5Stack A128 Watch V1.1 Development Kit (Excluding Core)Used with M5Core series, providing a seamless integration with powerful development capabilities.24/08/2023
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HARTING ix Industrial® Ethernet InterfacesFeature 360° contact shielding and 5000 mating cycles with an IP20 protection rating.18/08/2023
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Chip Quik F17xT254P20 Pitch ChangersOffer 1.70mm/1.78mm to 2.54mm pitch conversion range and are lead-free, RoHS 3, and REACH compliant.16/08/2023
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Chip Quik Dual Row AdaptersInclude DIP-08 Adapters to dual row 0.35mm pitch stencils to compact series adapters.16/08/2023
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Sensirion Fil cavalier SEN5xConçu pour les nœuds de capteurs environnementaux SEN5x et le kit d’évaluation SEK-SEN5x.09/08/2023
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Chip Quik Manual Syringe GunDesigned for 5cc syringes and offers excellent dispensing control.03/08/2023
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Chip Quik Dielectric Silicone GreaseElectronics grade translucent color grease designed for insulating electronics components.03/08/2023
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Chip Quik Solderability Testing Flux for Tin/Lead SolderIsopropyl alcohol-based no-clean liquid flux that does not require post-use cleaning.03/08/2023
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Amphenol Kit d’outils LMR® TK-400/400-75EZ-HCComprend les pinces à sertir CT-400/300, l’outil de préparation CST-400, l’outil de préparation CST-400-75 & l’outil de découpe CCT-03.21/07/2023
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Amphenol Outils de sertissage séries A™Disponible en kit ou en outil de sertissage individuel en taille 20, taille 16 et taille 12.13/07/2023
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Phoenix Contact Système de marquage THERMOMARK série EApproche radicalement novatrice de l'identification industrielle avec une impression et une application en une seule étape.07/07/2023
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Amphenol Outils à main de sertissageOutils de qualité professionnelle pour les applications en phase de prototypage ou de petites quantités de production.21/06/2023
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Red Pitaya STEMlab 125-14 Edu Pack KitAcademic kit based on Red Pitaya’s DAQ platform with a variety of accessories.02/06/2023
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EAO Series 09 Universal SwitchesIdeally suited for use in vehicle interiors and safety-relevant applications.26/05/2023
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HARTING UIC 558 InterfacesTwo interfaces, with inserts for 13 or 18 pins, and an additional solution with 22 pins22/05/2023
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Seeed Studio Produits de la série XIAOUne série de cartes de développement qui redéfinit la conception des systèmes électroniques.19/05/2023
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IDEC HT4P Safety CommanderAttaches to a 10" to 13" tablet, can be a replacement for touch panels on industrial control panels.19/05/2023
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HellermannTyton 596-03946 Solar Label Value PackContains an assortment of 36 labels per kit, required for AC micro-inverter installations.16/05/2023
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EAO 09 Series Rugged CAN-Based KeypadsHigh reliability keypads designed for E1 applications and safety-relevant applications.26/04/2023
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Sensepeek PCBite KitsInclude a base plate, holder, insulation washer, and insulation cover (not available in all kits).01/04/2023
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HARTING Mini connecteurs ix Industrial push-pullLa version étanche à l'eau et à la poussière de l'interface Gbit Ethernet ix Industrial30/03/2023
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Amphenol Connecteurs VITA 91 nouvelle génération MIL-HD2Conçus pour répondre aux exigences de débit de données 56 Gb/s PAM4 avec une densité plus élevée de pas 1,8 mm.24/03/2023
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