CP39136H

Solutions de gestion thermique

Les solutions de gestion thermique de CUI Devices sont essentielles aux performances du système en réduisant la chaleur indésirable. La gamme dédiée à la gestion thermique de CUI Devices répond aux défis thermiques croissants dans les applications électroniques actuelles au niveau de la carte et inclut une gamme de ventilateurs axiaux CC, de soufflantes, de dissipateurs thermiques, de dispositifs de refroidissement thermoélectrique (TEC) Peltier et d’accessoires thermiques.

arcTEC Structure High-Performance Peltier Modules

Same Sky High-Performance Peltier Modules with arcTEC™ Structure feature a unique construction that delivers superior cooling performance and longer cycle life. The innovative arcTEC structure combats the effects of thermal fatigue found in thermoelectric modules. The structure incorporates a thermally conductive resin between the electrical interconnect and ceramic on the cold side of the module, high-temperature solder, and larger P/N elements made from a premium silicon ingot. The combination of these three enhancements greatly improves the reliability, performance, and cycle life of Peltier modules built with the arcTEC structure, allowing thedevices to outperform conventional thermoelectric coolers in the most demanding applications.

Peltier Thermoelectric Cooling Devices

CUI Peltier thermoelectric cooling (TEC) devices fulfill the thermal management needs of a variety of applications. Ideal for designs where size and weight are limited, these Peltier devices range in size from 10mm to 70mm with profiles as low as 3mm. CUI Peltier TEC devices also have no moving parts, virtually eliminating the need for maintenance. Several high performance Peltier modules built with the arcTEC™ structure are also available, offering improved reliability, performance, and cycle life.