Heat Sinks for AMD Kria™ K26 SOMs

Advanced Thermal Solutions Heat Sinks for AMD Kria™ K26 SOMs are designed to fit the K26 System-On-Module (SOM). These heatsinks are engineered to mount seamlessly to the K26 SOM’s standard heat spreader plate. These heat sinks include high-performance Thermal Interface Material (TIM) and necessary hardware and maximize heat dissipation to keep the device below critical thermal thresholds. These modules are used with AMD’s two starter kits (Robotics and Vision AI). Typical applications include robotics, industrial communications and control, retail analytics, security, smart cameras, and machine vision.

Résultats: 6
Sélectionner Image Référence Fab. Description Fiche technique Disponibilité Prix (EUR) Filtrer les résultats dans le tableau par prix unitaire basé sur votre quantité. Qté. RoHS Modèle de ECAO Produit Longueur Largeur Hauteur
Advanced Thermal Solutions Dissipateurs Heat Sink for AMD Xilinx Kria K26 SoM Device, Active, Straight, 54x68x20mm 158En stock
Min. : 1
Mult. : 1

Advanced Thermal Solutions Dissipateurs Heat Sink for AMD Xilinx Kria K26 SoM Device, Active, Straight, 54x68x10mm 352En stock
Min. : 1
Mult. : 1

BGA Heat Sink 54 mm 68 mm 20 mm
Advanced Thermal Solutions Dissipateurs maxiFLOW Heat Sink for AMD Xilinx Kria K26 SoM Device, Passive, 54x68x9.76mm 93En stock
Min. : 1
Mult. : 1

Advanced Thermal Solutions Dissipateurs maxiFLOW Heat Sink for AMD Xilinx Kria K26 SoM Device, Passive, 54x68x25mm 104En stock
Min. : 1
Mult. : 1

Advanced Thermal Solutions Dissipateurs Heat Sink for AMD Xilinx Kria K26 SoM Device, Passive, Straight, 54x68x10mm 86En stock
Min. : 1
Mult. : 1

Advanced Thermal Solutions Dissipateurs Heat Sink for AMD Xilinx Kria K26 SoM Device, Passive, Straight, 54x68x20mm 29En stock
10027/03/2026 attendu
Min. : 1
Mult. : 1