Produits d'interface thermique

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TGF 2900LVO 2.9W/m-K Limited Outgassing Gap Filler

Bergquist Company TGF 2900LVO 2.9W/m-K Limited Outgassing Gap Filler is a silicone, two-part, room-temperature curable gap filler ideal for various electronic assembly applications. With 2.9W/(m.K) thermal conductivity and the possibility to achieve an ultra-thin bondline thickness, an excellent and versatile solution is provided that optimizes heat dissipation in challenging conditions. Additional features include enhanced performance, low volatility for limited siloxane outgassing, 24-hour room-temperature cure for a long working time, and excellent handling properties for long-term reliability and performance. Bergquist Company TGF 2900LVO Gap Filler is suitable for automotive control modules, applications sensitive to siloxane outgassing, and applications where heat transfer needs to be optimized by the material's thin bondline.

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