CA Modules multiprotocoles

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Qté. RoHS Modèle de ECAO Série
Fréquence
Alimentation en sortie
Type d'interface
Tension d’alimentation - Min.
Tension d’alimentation - Max.
Température de fonctionnement min.
Température de fonctionnement max.
Type de connecteur d'antenne
Dimensions
Protocole : Bluetooth, BLE - 802.15.1
Protocole - Cellulaire, NBIoT, LTE
Protocole - GPS, GLONASS
Protocole - Sous-Ghz
Protocole : Wi-Fi - 802.11
Protocole : ANT, Thread, Zigbee - 802.15.4
Qualification
Conditionnement
Texas Instruments Modules multiprotocoles TI WiLink8 SGL-Band Combo Mod A 595-WL18 A 595-WL1801MODGBMOCR
Fiche technique
589En stock
MouseReel disponible
Min. : 1
Mult. : 1
Bobine: 250

WL1801MOD 2.4 GHz - 20 C + 70 C BLE, Bluetooth 5.1 802.11 b/g/n Reel, Cut Tape, MouseReel

Texas Instruments Modules multiprotocoles WL18xxMOD Dual-Band Ind Mod A 595-WL1807 A 595-WL1807MODGIMOCR
Fiche technique
282En stock
MouseReel disponible
Min. : 1
Mult. : 1
Bobine: 250

WL1807MOD 2.4 GHz, 5 GHz 17.3 dBm SDIO, UART 2.9 V 4.8 V - 40 C + 85 C RF 13.4 mm x 13.3 mm x 2 mm BLE, Bluetooth 5.1 802.11 a/b/g/n Reel, Cut Tape, MouseReel
Insight SiP Modules multiprotocoles nRF52832 LoRa Transceiver & BLE 5 Module AS
Fiche technique
69En stock
Min. : 1
Mult. : 1
920 MHz to 923 MHz, 2.4 GHz 14 dBm SPI 1.8 V 3.6 V - 30 C + 85 C External 9.8 mm x 17.2 mm x 1.7 mm Bluetooth 5.0
Ezurio Modules multiprotocoles BLE v4.2 Module NFC Integrated Ant. (Nordic nRF52832)
Fiche technique
906En stock
Min. : 1
Mult. : 1

BL65x 2.4 GHz 4 dBm GPIO, I2C, SPI, UART 1.8 V 3.6 V - 40 C + 85 C Chip 14 mm x 10 mm x 2.1 mm Bluetooth LE NFC Cut Tape
Telink Modules multiprotocoles Telink Semiconductor is a fabless IC design company of state-of-the art wireless connectivity SoCs. Through years of research and development, Telink has built a comprehensive product portfolio and become one of the world-leading IC suppliers in this
Fiche technique
6En stock
Min. : 1
Mult. : 1

ML7 2.4 GHz to 2.483 GHz 8.5 dBm I2C, SPI, UART 1.8 V 4.3 V - 40 C + 85 C 26 mm x 11.3 mm x 2.6 mm Reel
M5Stack Modules multiprotocoles a highly integrated embedded module based on the Espressif ESP32-S3FN8, equipped with a 240MHz Xtensa 32-bit LX7 dual-core processor, integrated 8MB Flash
Fiche technique
7En stock
1020/03/2026 attendu
Min. : 1
Mult. : 1

I2C 25.93 mm x 18 mm x 4.7 mm
Intel Modules multiprotocoles Intel Wi-Fi 6 AX201 (Gig+), 2230, 2x2 AX+BT, vPro
Fiche technique
28En stock
Min. : 1
Mult. : 1

AX201 2.4 GHz, 5 GHz Bluetooth, M.2, WiFi 0 C + 80 C 22 mm x 30 mm x 2.4 mm Bluetooth 5.2 802.11 ax
Telink Modules multiprotocoles Telink Semiconductor is a fabless IC design company of state-of-the art wireless connectivity SoCs. Through years of research and development, Telink has built a comprehensive product portfolio and become one of the world-leading IC suppliers in this
Fiche technique
6En stock
Min. : 1
Mult. : 1

ML3 2.4 GHz to 2.483 GHz 8.4 dBm I2C, SPI, UART 1.8 V 4.3 V - 40 C + 125 C 26 mm x 11.3 mm x 2.6 mm Zigbee Reel
Pulse Electronics Modules multiprotocoles USB 802.11 b/g/n BT module
746En stock
Min. : 1
Mult. : 1

TWR 2.4 GHz 14 dBm, 16 dBm USB 2.0 3 V 3.6 V - 5 C + 60 C 14.7 mm x 10.8 mm x 3.2 mm BLE, Bluetooth 802.11 b/g/n Tray
Silex Technology Modules multiprotocoles [Sample Pack] SX-SDMAX-2530C is a board-to-board connector type board implementing the SX-SDMAX-2530S. It is a 2.4 GHz/5 GHz dual-band Wi-Fi 6 plus Bluetooth v5.3 BR/EDR/LE SDIO 3.0 module using the NXP IW611 chipset.It includes an MHF-I connector f
Fiche technique
10En stock
Min. : 1
Mult. : 1

SX-SDMAX 2.4 GHz/5 GHz Bluetooth, WiFi, UART 3.14 V 3.46 V - 40 C + 85 C 24 mm x 24 mm x 4.45 mm Bulk
Silex Technology Modules multiprotocoles [Sample Pack] Low power version SMT type 802.11ah SDIO Wi-Fi HaLow module using MM6108.
Fiche technique
15En stock
Min. : 1
Mult. : 1

23 dBm SPI - 40 C + 85 C MHF1 18 mm x 17 mm x 2.65 mm 802.11 ah Cut Tape
CEL Modules multiprotocoles CMP9670 Tri-Band Wi-Fi 6e 2x2 MU-MIMO DBS BT5.2 Half-size Mini-PCIe Card
Fiche technique
2En stock
Min. : 1
Mult. : 1

CMP9670 PCIe, USB Bluetooth Bulk
u-blox Modules multiprotocoles 88W8887, 802.11ac+BT, 1 antenna pin
Fiche technique
278En stock
Min. : 1
Mult. : 1
Bobine: 500

2.4 GHz, 5 GHz 18 dBm GPIO, SDIO, UART 2.97 V 3.63 V - 40 C + 85 C External 19.8 mm x 13.8 mm x 2.5 mm Bluetooth 4.2 802.11 a/b/g/n/ac Reel, Cut Tape
Seeed Studio Modules multiprotocoles The factory is currently not accepting orders for this product. 188En stock
Min. : 1
Mult. : 1

2.4 GHz, 5 GHz USB 3.6 V 3.6 V u.FL 92 mm x 32 mm x 25 mm Bluetooth 5.0 802.11 b/g/n
Intel Modules multiprotocoles Intel Wi-Fi 6 AX200, 1216, 2x2 AX+BT, No vPro , LTE Coex, UART
Fiche technique
490En stock
Min. : 1
Mult. : 1

Wi-Fi 6 AX200 2.4 GHz, 5 GHz PCIe, USB 0 C + 80 C 12 mm x 16 mm x 1.65 mm Bluetooth 5.2 LTE 802.11 ax
Silex Technology Modules multiprotocoles [Sample Pack] SX-PCEAX-SMT-SP is a sample pack SKU ideal for small quantities used for small pilot builds. SX-PCEAX-SMT-SP is a 2.4 GHz/5 GHz /6 GHz Tri-band IEEE802.11 ax WLAN, Bluetooth 5.2 BR/EDR/HS/LE module in an M.2 LGA Type 1418 Surface Mount
Fiche technique
253En stock
9729/04/2026 attendu
Min. : 1
Mult. : 1

SX-PCEAX 2.4 GHz, 5 GHz, 6 GHz PCIe, USB 3.135 V 3.465 V - 20 C + 65 C MHF4 14 mm x 18 mm x 1.9 mm Bluetooth 5.2 802.11 a/b/g/n/ac/ax Bulk
Silex Technology Modules multiprotocoles [Sample Pack] SX-PCEAX-M2-SP is a sample pack SKU ideal for small quantities used for evaluation and small pilot builds. SX-PCEAX-M2-SP is a 2.4 GHz/5 GHz /6 GHz Tri-band IEEE802.11 ax WLAN, Bluetooth 5.2 BR/EDR/HS/LE module in an M.2 Card Type 2230
Fiche technique
161En stock
Min. : 1
Mult. : 1

SX-PCEAX 2.4 GHz, 5 GHz, 6 GHz PCIe, USB 3.135 V 3.465 V - 20 C + 65 C MHF4 22 mm x 30 mm x 2.7 mm Bluetooth 5.2 802.11 a/b/g/n/ac/ax Bulk
Fortebit Modules multiprotocoles Polaris 3G kit, includes: Polaris 3G board, aluminum case, GPS/Glonass/GSM antenna, main connector cable, LiPo battery.
Fiche technique
1En stock
Min. : 1
Mult. : 1

800 MHz, 850 MHz, 900 MHz, 1.8 GHz, 1.9 GHz, 2.1 GHz 33 dBm I2C, SPI, UART 8 V 36 V - 35 C + 80 C SMA 3G GSM GLONASS, GPS
Ezurio Modules multiprotocoles RF Module, Sterling LWB+, Chip Antenna, CutTape CYW43439
Fiche technique
154En stock
1 00011/08/2026 attendu
Min. : 1
Mult. : 1

Sterling-LWB+ 2.4 GHz 18 dBm SDIO, UART 3.2 V 4.8 V - 40 C + 85 C Chip 21 mm x 15.5 mm x 4 mm Bluetooth 5.2 WiFi 4, 802.11 b/g/n Cut Tape
Silicon Labs Modules multiprotocoles Mighty Gecko lighting module, +12 dBm, 2.4 GHz, 1 MB Flash, -40 to 105 C, PCB trace antenna, certified.
Fiche technique
99En stock
Min. : 1
Mult. : 1

MGM210L 2.4 GHz 12.5 dBm I2C, SPI, UART 1.8 V 3.8 V - 40 C + 105 C PCB 12.5 mm x 15.5 mm x 2.25 mm Bluetooth 5.3 802.15.4 (ANT, Thread, Zigbee) Cut Tape
Fortebit Modules multiprotocoles Polaris 3G kit, includes: Polaris 3G board, aluminum case, GPS/Glonass/GSM antenna, main connector cable.
Fiche technique
5En stock
Min. : 1
Mult. : 1

800 MHz, 850 MHz, 900 MHz, 1.8 GHz, 1.9 GHz, 2.1 GHz 33 dBm I2C, SPI, UART 8 V 36 V - 35 C + 80 C SMA 3G GSM GLONASS, GPS
DFRobot Modules multiprotocoles ESP32-C3-WROOM-02-N4 Module (PCB antenna) 29En stock
Min. : 1
Mult. : 1
2.4 GHz I2C, I2S, SPI, UART 3 V 3.6 V - 40 C + 85 C PCB Bluetooth 5.0 802.11 b/g/n
Intel Modules multiprotocoles Intel Wi-Fi 6 AX201 (Gig+), 2230, 2x2 AX+BT, No vPro
Fiche technique
16En stock
Min. : 1
Mult. : 1

AX201 2.4 GHz, 5 GHz Bluetooth, M.2, WiFi 0 C + 80 C 22 mm x 30 mm x 2.4 mm Bluetooth 5.2 802.11 ax
DFRobot Modules multiprotocoles ESP32-C3-MINI-1-N4 Module (PCB antenna) 28En stock
Min. : 1
Mult. : 1
2.4 GHz I2C, I2S, SPI, UART 3 V 3.6 V - 40 C + 85 C PCB Bluetooth 5.0 802.11 b/g/n
Ezurio Modules multiprotocoles RF Module, Sterling LWB+, MHF4, Cut Tape CYW43439
Fiche technique
75En stock
Min. : 1
Mult. : 1

Sterling-LWB+ 2.4 GHz 18 dBm SDIO, UART 3.2 V 4.8 V - 40 C + 85 C RF 21 mm x 15.5 mm x 4 mm Bluetooth 5.2 WiFi 4, 802.11 b/g/n Cut Tape