Renesas Electronics Composants RF et sans fil

Boucles à phase asservie - PLL XUH7 APXOXXX

Boucles à phase asservie - PLL XUH7 APXOXXX

Boucles à phase asservie - PLL XUH7 APXOXXX

Boucles à phase asservie - PLL XUL5 APXOXXX

Système RF sur puce - SoC Bluetooth Low Energy 4.2 SoC with integrated ARM Cortex M0, PMU, memories and peripherals ? 12 GPIOsin WL-CSP34 and 0.4mm ball pitch package

Système RF sur puce - SoC Bluetooth Low Energy 4.2 SoC with Flexpower ARM Cortex M0, crypto, PMU, memories and peripherals - 37 GPIOs in AQFN60 package and 0.55mm pin pitch

Système RF sur puce - SoC Bluetooth Low Energy 5.0 SoC with integrated ARM Cortex M0, PMU, memories, voice interface and peripherals, 105degC ? 25 GPIOsin QFN40 and 0.4mm pin pitch package

Système RF sur puce - SoC Bluetooth Low Energy 5.1 SoC with integrated ARM Cortex M0+, memories and peripherals ? 12 GPIOs in FCGQFN24 and 0.4mm ball pitch package

Système RF sur puce - SoC Bluetooth Low Energy 5.1 SoC with integrated ARM Cortex M0+, memories and peripherals ? 6 GPIOs in WL-CSP17 and 0.5mm ball pitch package

Système RF sur puce - SoC Multi-core wireless MCU for Bluetooth 5.2 and proprietary 2G4 protocols

Outils de développement Bluetooth - 802.15.1 Bluetooth Low Energy DA14706 daughter board

Outils de développement Wi-Fi - 802.11 CHGS Wi-Fi 6/6E 2T2R + BT-Tri-Band LGA Module