Ezurio Sona™ NX611 Wi-Fi 6 + BLUETOOTH® 5.4 Modules
Ezurio Sona™ NX611 Wi-Fi® 6 + BLUETOOTH® 5.4 Modules are highly integrated 2.4/5GHz dual-band 1x1 Wi-Fi 6, Bluetooth/Bluetooth Low Energy 5.4 single-chip solutions optimized for a broad array of IoT and industrial applications. The pre-calibrated devices integrate the complete transmit/receive RF paths, including diplexer, low noise amplifiers (LNAs), RF switches, reference crystal oscillators, and power management units (PMU). Ezurio Sona NX611 modules include a full-feature Wi-Fi subsystem powered by NXP’s 802.11ax (Wi-Fi 6) technology, bringing higher throughput, better network efficiency, lower latency, and improved range over previous generation Wi-Fi standards. The Wi-Fi subsystem integrates a Wi-Fi MAC, baseband, and direct-conversion radio with integrated PA, LNA, and transmit/receive switch, removing the need for an RF front-end module (FEM), saving cost, and reducing system complexity. The modules include various form factors, integration levels, and RF paths to accommodate user applications.Features
- Tested with the NXP family of processors and Ezurio's (formerly Laird Connectivity) Linux backports
- Integrated PA (power amplifier) and LNA (low noise amplifier) with 1x1 antenna for reliable connectivity in harsh RF environments
- Rich feature set including 802.11ax Wi-Fi 6 and Dual-Mode Bluetooth v5.4
- Industrial operating temperature range and options for solder-down modules are suitable for industrial rugged applications
- Supports WPA2/WPA3 Enterprise security standards
Applications
- Medical
- Industrial
- IoT sensors
- Consumer
- Handheld mobility
Specifications
- Wi-Fi
- IEEE 802.11a/b/g/n/ac/ax, 1x1 SISO 2.4GHz and 5GHz, up to 80MHz channel bandwidth
- Up to 480Mbps peak data rates
- Integrated high-power PA up to +21dBm transmit power
- Integrated LNA and T/R switches
- UL/DL OFDMA
- 802.11ax TWT (station only)
- 802.11ax ER, DCM
- WPA2 and WPA3 personal and enterprise security
- Support for Matter over Wi-Fi
- Bluetooth
- Supports Bluetooth 5.2 (Class 1/Class 2) and Bluetooth Low Energy features
- Bluetooth 5.4 certified
- Integrated high-power PA up to +19dBm transmit power for Bluetooth LE and BDR1, 2, and 3
- Integrated high-power PA up to +10dBm transmit power for EDR
- BDR/EDR packet types
- 1Mbps (GFSK)
- 2Mbps (/4-DQPSK)
- 3Mbps (8DPSK)
- Bluetooth LE long-range (125/500kbps) support
- Bluetooth LE 2Mbps
- Bluetooth LE advertising extensions for improved capacity
- Isochronous channels (ISOC) supporting LE Audio and Auracast™ Broadcast Audio
- NXP IW611 wireless chipset
- 2.4GHz and 5GHz frequencies
- Supply voltages
- 3.3V and 1.8V for the SIP 76-pin LGA
- 3.3V for the 1216 96-pin LGA
- 3.3V for the 2230 75-pin PCIe M.2
- Simultaneous Wi-Fi/Bluetooth receive with single and dual antenna/RF pad configurations supported
- Coexistence
- Internal coexistence between Wi-Fi and Bluetooth
- External coexistence interface for connection to external radios such as LTE
- Power management
- Efficient power management system
- Deep-sleep low-power mode
- Integrated high-efficiency buck DC-DC converter
- Wake-up through GPIO, host interface, and RTC
- One Time Programmable (OTP) memory to store the MAC address and calibration data
- Security
- Hardware root of trust
- Authenticated and secured boot
- OTP-based life-cycle state support
- Package options
- SIP 76-pin LGA, 11mm x 11mm
- 1216 96-pin LGA, 12mm x 16mm
- 2230 75-pin PCIe M.2, 22mm x 30mm
- -40°C to +85°C operating temperature range
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Publié le: 2024-07-15
| Mis à jour le: 2025-07-30
