- 40 C Modules multiprotocoles

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Qté. RoHS Modèle de ECAO Série
Fréquence
Alimentation en sortie
Type d'interface
Tension d’alimentation - Min.
Tension d’alimentation - Max.
Température de fonctionnement min.
Température de fonctionnement max.
Type de connecteur d'antenne
Dimensions
Protocole : Bluetooth, BLE - 802.15.1
Protocole - Cellulaire, NBIoT, LTE
Protocole - GPS, GLONASS
Protocole - Sous-Ghz
Protocole : Wi-Fi - 802.11
Protocole : ANT, Thread, Zigbee - 802.15.4
Qualification
Conditionnement
Microchip Technology Modules multiprotocoles Wi-Fi + Bluetooth LE Module,u.FL Antenna
Fiche technique
41En stock
Min. : 1
Mult. : 1
: 500

2.4 GHz 18.3 dBm I2C, SPI, UART 2.7 V 3.6 V - 40 C + 85 C u.FL 22.43 mm x 14.73 mm x 2 mm Bluetooth 5.0 802.11 b/g/n Reel, Cut Tape
Microchip Technology Modules multiprotocoles ATWINC3400 802.11 b/g/n + Bluetooth 5 Module Chip Antenna
Fiche technique
22En stock
Min. : 1
Mult. : 1
2.4 GHz 18.3 dBm I2C, SPI, UART 2.7 V 3.6 V - 40 C + 85 C Chip 22.43 mm x 14.73 mm x 2 mm Bluetooth 5.0 Tray

Silicon Labs Modules multiprotocoles Mighty Gecko ARM Cortex-M4 512 kB flash, 64 kB RAM module
Fiche technique
44En stock
Min. : 1
Mult. : 1
: 1 000

MGM13P 2.4 GHz I2C, UART, USART 1.8 V 3.8 V - 40 C + 85 C 12.9 mm x 17.8 mm x 2.3 mm Reel, Cut Tape
Silicon Labs Modules multiprotocoles Wireless gecko multi-protocol module, +10 dBm, 2.4 GHz, 1 MB Flash, -40 to 125 C, built-in antenna, certified.
Fiche technique
8En stock
Min. : 1
Mult. : 1

MGM210P 2.4 GHz 10 dBm I2C, USART 1.8 V 3.8 V - 40 C + 125 C Built-In, RF 12.9 mm x 15 mm x 2.2 mm Bluetooth 5.3 802.15.4 (ANT, Thread, Zigbee) Cut Tape
Silicon Labs Modules multiprotocoles MGM210P Wireless Gecko Multiprotocol Module, PCB, Secure Vault, +10 dBm, 2.4 GHz, 1 MB Flash, -40 to 125 C, Built-in Antenna & RF Pin
Fiche technique
37En stock
Min. : 1
Mult. : 1

2.4 GHz 10 dBm I2C, USART 1.8 V 3.8 V - 40 C + 125 C Built-In, RF 12.9 mm x 15 mm x 2.2 mm Bluetooth 5.3 802.15.4 (ANT, Thread, Zigbee) Cut Tape

Silicon Labs Modules multiprotocoles Wireless bluetooth SiP module, Secure Boot with Root of Trust and Secure Loader(RTSL), MVP, 78 MHz, 10 dBm
Fiche technique
9En stock
1 30023/10/2026 attendu
Min. : 1
Mult. : 1

xGM240S 2.4 GHz 10 dBm I2C, USART 1.8 V 3.8 V - 40 C + 105 C Built-In, RF 7 mm x 7 mm x 1.18 mm Bluetooth 5.3 802.15.4 (ANT, Thread, Zigbee) Tray
Seeed Studio Modules multiprotocoles EMC3080 WI-FI&BLE Module - Support MXMESH 5En stock
Min. : 1
Mult. : 1
2.4 GHz I2C, SPI 2.7 V 3.3 V - 40 C + 105 C IPEX, PCB 2.4 cm x 2.6 cm x 0.3 cm Bluetooth 5.0 802.11 b/g/n
Renesas / Dialog Modules multiprotocoles Wi-Fi/BLE Combo Module (Chipset antenna)
Fiche technique
110En stock
50015/12/2026 attendu
Min. : 1
Mult. : 1
: 500

DA16600 2.4 GHz 18 dBm I2C, I2S, PWM, SPI, SWD, JTAG, UART 1.8 V 3.3 V - 40 C + 85 C Chip 14.3 mm x 24.3 mm x 3 mm Bluetooth 5.1 802.11 b/g/n Reel, Cut Tape
NXP Semiconductors Modules multiprotocoles IW610FUK/A1ZDI
Fiche technique
25En stock
Min. : 1
Mult. : 1
: 2 000

IW610FUK 2.4 GHz, 5 GHz 23 dBm SDIO, SPI, UART, USB 3.14 V 3.46 V - 40 C + 125 C Bluetooth, BLE WiFi 6 Reel, Cut Tape
Digi Modules multiprotocoles Digi XBee 3 Global LTE-M/NB-IoT, GNSS, 2G fallback, Telit ME310G1-WW, No SIM
Fiche technique
3 285Sur commande
Min. : 1
Mult. : 1

XBee 3 I2C, SPI, UART 3.3 V 4.3 V - 40 C + 85 C u.FL 24.38 mm x 32.94 mm
Embedded Artists Modules multiprotocoles 1XK M.2 Wi-Fi 4 a/b/g/n, Bluetooth 5.2 with IW416 chipset and LBEE5CJ1XK module
Fiche technique
2En stock
4Sur commande
Min. : 1
Mult. : 1

2.4 GHz, 5 GHz 4-Wire UART, SDIO 3 V 3.5 V - 40 C + 85 C Integrated 22 mm x 44 mm Bluetooth 5.2 802.11 b/g/n Bulk
Quectel Modules multiprotocoles Wi-Fi 6, single band 2.4GHz, BLE 5.1, Antenna: LCC, -40 85C, 4MB flash
Fiche technique
1 486En stock
Min. : 1
Mult. : 1
: 500

2.4 GHz I2C, I2S, SPI, UART 3 V 3.6 V - 40 C + 85 C 25.5 mm x 18 mm x 3.2 mm Bluetooth 5.1 802.11 b/g/n/ax Reel, Cut Tape
Quectel Modules multiprotocoles Wi-Fi 6, single band 2.4GHz, BLE 5.1, Antenna: PCB, -40 85C, 4MB flash
Fiche technique
1 350En stock
Min. : 1
Mult. : 1
: 500

2.4 GHz I2C, I2S, SPI, UART 3 V 3.6 V - 40 C + 85 C 25.5 mm x 18 mm x 3.2 mm Bluetooth 5.1 802.11 b/g/n/ax Reel, Cut Tape
Quectel Modules multiprotocoles Wi-Fi 6, single band 2.4GHz, BLE 5.1, Antenna: IPEX-1, -40 85C, 4MB flash
Fiche technique
1 463En stock
Min. : 1
Mult. : 1
: 500

2.4 GHz I2C, I2S, SPI, UART 3 V 3.6 V - 40 C + 85 C 25.5 mm x 18 mm x 3.2 mm Bluetooth 5.1 802.11 b/g/n/ax Reel, Cut Tape
Microchip Technology Modules multiprotocoles ATWINC3400 802.11 b/g/n + Bluetooth 5 Module Chip Antenna T&R
Fiche technique
60En stock
Min. : 1
Mult. : 1
: 500

ATWINC3400 2.4 GHz 18.3 dBm I2C, SPI, UART 2.7 V 3.6 V - 40 C + 85 C Chip 22.43 mm x 14.73 mm x 2 mm Bluetooth 5.0 802.11 b/g/n Reel, Cut Tape
Microchip Technology Modules multiprotocoles ATWINC3400 802.11 b/g/n + Bluetooth 5 Module Chip Antenna T&R
Fiche technique
25En stock
Min. : 1
Mult. : 1
: 500

ATWINC3400 2.4 GHz 18.3 dBm I2C, SPI, UART 2.7 V 3.6 V - 40 C + 85 C Chip 22.43 mm x 14.73 mm x 2 mm Bluetooth 5.0 802.11 b/g/n Reel, Cut Tape
Fanstel Modules multiprotocoles Mini nRF52811 BLE 5.4 module, 192KB flash,24KB RAM, high performance PCB antenna, approtect
Fiche technique
52En stock
Min. : 1
Mult. : 1
: 1 000

BM833 2.4 GHz I2S 1.7 V 3.6 V - 40 C + 85 C 10.2 mm x 20.6 mm x 1.9 mm Reel, Cut Tape
Silicon Labs Modules multiprotocoles SiWG917Y SoC Module Wi-Fi 6 2.4 GHz Bluetooth LE 5.4 No Antenna, 2MB PSRAM in package
Fiche technique
550Sur commande
Min. : 1
Mult. : 1

SIWG917Y I2C, SPI, UART, USART 1.71 V 3.63 V - 40 C + 85 C Cut Tape
Espressif Systems Modules multiprotocoles SMD module, ESP32-C3FH4, PCB antenna, -40C - +105C
Fiche technique
30En stock
Min. : 1
Mult. : 1

2.4 GHz 20.5 dBm GPIO, I2C, I2S, SPI, UART 2.7 V 3.6 V - 40 C + 105 C PCB 13.2 mm x 16.6 mm x 2.4 mm Bluetooth 802.11 b/g/n Reel, Cut Tape
Ezurio Modules multiprotocoles Module, Sterling-EWB, U.FL, Cut Tape
Fiche technique
3En stock
Min. : 1
Mult. : 1

Sterling-EWB 2.4 GHz 17.5 dBm SPI, UART 3 V 3.6 V - 40 C + 85 C u.FL 16 mm x 21 mm Bluetooth 5.1 802.11 b/g/n Cut Tape
SparkFun Modules multiprotocoles The Digi XBee 3 global cellular module is a cutting-edge compact module engineered for rapid integration of cellular IoT capabilities. This innovative solution is equipped with cellular and BLE connectivity with end-device carrier certifications an
Fiche technique
1En stock
Min. : 1
Mult. : 1
23 dBm SPI, UART, USB 3.3 V 4.3 V - 40 C + 85 C SMA 32.94 mm x 24.38 mm BLE LTE-M/NBIoT GNSS
CEL Modules multiprotocoles WiFi+BLE, USB, Conn.
Fiche technique
105En stock
Min. : 1
Mult. : 1

CMP9377 2.4 GHz, 5 GHz 20 dBm USB 3.3 V 3.3 V - 40 C + 85 C External 17 mm x 12 mm x 3 mm Bluetooth 5.0 802.11 a/b/g/n/ac Tray
Quectel Modules multiprotocoles Amazon Sidewalk IoT module (US version only)
Fiche technique
100En stock
Min. : 1
Mult. : 1
: 500

2.4 GHz I2C, SPI, UART 1.8 V 3.3 V - 40 C + 85 C 15 mm x 15 mm x 2.25 mm BLE 5.1 Reel, Cut Tape
SparkFun Modules multiprotocoles ESP32-C6 is Espressif s first WiFi 6 SoC integrating 2.4 GHz WiFi 6 Bluetooth 5 (LE) and the 802.15.4 protocol. It features an industry-leading RF performance with reliable security features and multiple memory resources for IoT products. It cons
Fiche technique
29En stock
Min. : 1
Mult. : 1
2.4 GHz GPIO, I2C, I2S, Parallel, SPI, UART 3 V 3.6 V - 40 C + 85 C PCB 19.2 mm x 18 mm x 3.2 mm Bluetooth 5.3, Bluetooth Mesh 802.11 b/g/n/ax Thread, Zigbee
SparkFun Modules multiprotocoles ESP32-C6 is Espressif s first WiFi 6 SoC integrating 2.4 GHz WiFi 6 Bluetooth 5 (LE) and the 802.15.4 protocol. It features an industry-leading RF performance with reliable security features and multiple memory resources for IoT products. It cons
Fiche technique
6En stock
Min. : 1
Mult. : 1
2.4 GHz GPIO, I2C, I2S, Parallel, SPI, UART 3 V 3.6 V - 40 C + 85 C PCB 19.2 mm x 18 mm x 3.2 mm Bluetooth 5.3, Bluetooth Mesh 802.11 b/g/n/ax Thread, Zigbee