- 40 C Modules multiprotocoles

Résultats: 726
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Qté. RoHS Modèle de ECAO Série
Fréquence
Alimentation en sortie
Type d'interface
Tension d’alimentation - Min.
Tension d’alimentation - Max.
Température de fonctionnement min.
Température de fonctionnement max.
Type de connecteur d'antenne
Dimensions
Protocole : Bluetooth, BLE - 802.15.1
Protocole - Cellulaire, NBIoT, LTE
Protocole - GPS, GLONASS
Protocole - Sous-Ghz
Protocole : Wi-Fi - 802.11
Protocole : ANT, Thread, Zigbee - 802.15.4
Qualification
Conditionnement
u-blox Modules multiprotocoles M.2 card with JODY-W377, single package
Fiche technique
2304/08/2026 attendu
Min. : 1
Mult. : 1

JODY-W3 2.4 GHz, 5 GHz 16 dBm, 19 dBm GPIO, UART 3.135 V 3.465 V - 40 C + 85 C 30 mm x 22 mm x 3.21 mm 802.11 a/b/g/n Tray
Microchip Technology Modules multiprotocoles Bluetooth Low Energy/15.4 Combo Module with PCB Antenna and extended temperature
Fiche technique
14424/09/2026 attendu
Min. : 1
Mult. : 1

2.4 GHz 12 dBm 1.9 V 3.6 V - 40 C + 125 C 7 mm x 7 mm x 0.9 mm Bluetooth Zigbee Tray
Silicon Labs Modules multiprotocoles MGM220P wireless gecko
Fiche technique
18802/10/2026 attendu
Min. : 1
Mult. : 1

2.4 GHz 8 dBm Bluetooth, GPIO, I2C, UART 1.8 V 3.8 V - 40 C + 105 C Built-In 15 mm x 12.9 mm Bluetooth 5.2, Bluetooth Mesh Zigbee Cut Tape
NXP Semiconductors Modules multiprotocoles IW610BHN/A1ZDI
Fiche technique
2529/10/2026 attendu
Min. : 1
Mult. : 1

IW610BHN 2.4 GHz, 5 GHz 23 dBm SDIO, SPI, UART, USB 3.14 V 3.46 V - 40 C + 125 C Bluetooth, BLE WiFi 6 Tray
NXP Semiconductors Modules multiprotocoles IW610CHN/A1ZDI
Fiche technique
2529/10/2026 attendu
Min. : 1
Mult. : 1

IW610CHN 2.4 GHz, 5 GHz 23 dBm SDIO, SPI, UART, USB 3.14 V 3.46 V - 40 C + 125 C Bluetooth, BLE - 802.15.4 WiFi 6 Tray
NXP Semiconductors Modules multiprotocoles IW610FHN/A1ZDI
Fiche technique
2529/10/2026 attendu
Min. : 1
Mult. : 1
: 2 700

IW610FHN 2.4 GHz, 5 GHz 23 dBm SDIO, SPI, UART, USB 3.14 V 3.46 V - 40 C + 125 C Bluetooth, BLE WiFi 6 Reel, Cut Tape
NXP Semiconductors Modules multiprotocoles IW611HN/A1C
Fiche technique
2529/10/2026 attendu
Min. : 1
Mult. : 1
: 2 000

IW611HN GPIO, I2S, SDIO, UART - 40 C + 85 C Bluetooth 5.2 802.11 az Reel, Cut Tape
Murata Electronics Modules multiprotocoles Type 2DL-921, Shielded Small Wi-Fi 11a/b/g/n/ac/ax + Bluetooth 5.3 Module
Fiche technique
1 700Sur commande
MouseReel disponible
Min. : 1
Mult. : 1
: 1 000

2DL 2.4 GHz, 5 GHz 18 dBm UART 1.71 V 3.46 V - 40 C + 85 C u.FL 8.8 mm x 7.7 mm x 1.3 mm Bluetooth 5.3 Reel, Cut Tape, MouseReel
Murata Electronics Modules multiprotocoles Shielded Small Wi-Fi 11a/b/g/n/ac/ax + Bluetooth 5.3 Module Type 2EL
Fiche technique
3 988Sur commande
MouseReel disponible
Min. : 1
Mult. : 1
: 1 000

2EL 2.4 GHz, 5.8 GHz 20 dBm SPI 1.71 V 3.46 V - 40 C + 85 C 8.8 mm x 7.7 mm x 1.3 mm Bluetooth 5.3 802.11 a/b/g/n/ac/ax Reel, Cut Tape, MouseReel
Adafruit 5344
Adafruit Modules multiprotocoles ESP32 Dual Antenna WiFi + Bluetooth Module with 8MB FLASH - ESP32-WROOM-DA-N8
420/11/2026 attendu
Min. : 1
Mult. : 1

2.4 GHz 0 dBm, 19.5 dBm ADC, DAC, GPIO, I2C, I2S, IR, PWM, SD Card, SDIO, SPI, UART 3 V 3.6 V - 40 C + 85 C PCB 35.6 mm x 34.4 mm x 3.5 mm Bluetooth, Bluetooth 4.2 802.11 b/g/n
Murata Electronics Modules multiprotocoles BT 5.4/WIFI 6
Fiche technique
1 00014/08/2026 attendu
Min. : 1
Mult. : 1
: 1 000

17 dBm SPI 1.71 V 3.46 V - 40 C + 85 C 8.8 mm x 7.7 mm x 1.3 mm 802.11 a/b/g/n/ac/ax Reel, Cut Tape
Murata Electronics Modules multiprotocoles Type 2FY Infineon CYW55513 ShieldedSmall WiFi 11a/b/g/n/ac/ax SISO+BT 5.4 Module
Fiche technique
90012/08/2026 attendu
Min. : 1
Mult. : 1
: 1 000

2FY 2.4 GHz, 5 GHz, 6 GHz GPIO, UART 3 V 4.8 V - 40 C + 85 C 7.9 mm x 7.3 mm x 1.1 mm Bluetooth WiFi - 802.11 Reel, Cut Tape
Murata Electronics Modules multiprotocoles Type 2FR module
Fiche technique
97513/08/2026 attendu
Min. : 1
Mult. : 1
: 1 000

2FR 2.484 GHz 18 dBm SPI 3.14 V 3.46 V - 40 C + 85 C 12 mm x 11 mm x 1.5 mm Reel, Cut Tape
Murata Electronics Modules multiprotocoles RF TXRX MODULE 5.4/WIFI 6
Fiche technique
1 00022/12/2026 attendu
Min. : 1
Mult. : 1
: 1 000

17 dBm SPI 1.71 V 3.46 V - 40 C + 85 C 8.8 mm x 7.7 mm x 1.3 mm 802.11 a/b/g/n/ac/ax Reel, Cut Tape
Quectel Modules multiprotocoles
100Sur commande
Min. : 1
Mult. : 1
- 40 C + 85 C 16.6 mm x 13 mm x 2.05 mm Bluetooth, BLE
Murata Electronics Modules multiprotocoles Type 1XK Shielded ultra-small dual bandWi-Fi 11a/b/g/n/ac Bluetooth 5.2
Fiche technique
97224/12/2026 attendu
Min. : 1
Mult. : 1
: 500

1XK 2.4 GHz, 5 GHz UART 2.7 V 5.5 V - 40 C + 85 C u.FL 9.1 mm x 8.3 mm x 1.3 mm Bluetooth 5.2 Reel, Cut Tape
Quectel Modules multiprotocoles Wi-Fi 4, 2.4GHz, BLE 5.2, Antenna: LCC(ANT_WIFI/BT), 2MB flash
Fiche technique
10021/07/2027 attendu
Min. : 1
Mult. : 1
: 500

2.4 GHz 6 dBm, 13 dBm, 14 dBm, 15 dBm, 16 dBm I2C, SPI, UART 3 V 3.6 V - 40 C + 85 C 20 mm x 18 mm x 2.6 mm Bluetooth 5.2 Wi-Fi 4 Reel, Cut Tape
Quectel Modules multiprotocoles Wi-Fi 6, 802.11a/ b/ g/ n/ ac/ ax, 2 2 (2T2R), 2.4/ 5 GHz dual-band, PCIe interface, 2 antennas (BT 5.2 shares 1 Wi-Fi antenna), -40 C to +85 C
Fiche technique
10016/12/2026 attendu
Min. : 1
Mult. : 1
: 1 000
2.4 GHz, 5 GHz 3.1 V 3.6 V' - 40 C + 85 C 15 mm x 13 mm x 2.2 mm Bluetooth 5.2 Wi-Fi 6 Reel, Cut Tape
Quectel Modules multiprotocoles Wi-Fi 6 (dual band 2.4/5GHz) & Bluetooth 5.4 (Bluetooth LE Audio and BLE Long Range), SDI 3.0 interface, 1x antenna, -40 C to +85 C
Fiche technique
10014/08/2026 attendu
Min. : 1
Mult. : 1
: 1 000
2.4 GHz, 5 GHz UART 3 V 4.8 V - 40 C + 85 C 12 mm x 12 mm x 1.55 mm Bluetooth 5.4 WiFi 6 Reel, Cut Tape
Quectel Modules multiprotocoles Wi-Fi 4, 2.4GHz, BLE 5.2, Antenna: PCB, extended temp -40 105C, 2MB flash
10014/08/2026 attendu
Min. : 1
Mult. : 1
: 250
2.4 GHz - 40 C + 105 C Reel, Cut Tape
Quectel Modules multiprotocoles Wi-Fi 6 (2.4GHz/5GHz), ?IEEE 802.11a/b/g/n/ac/ax, BLE 5.4, Thread 802.15.4, Antenna 1 1 (1T1R), 2 antennas, Wi-Fi application: SDIO 3.0, -40C +85C
Fiche technique
10011/09/2026 attendu
Min. : 1
Mult. : 1
: 500
2.4 GHz, 5 GHz SPI, UART, USB 3.14 V 3.46 V - 40 C + 85 C PCB Antenna 23 mm x 14 mm x 2.2 mm BLE 5.4 802.11 a/b/g/n/ac/ax Reel, Cut Tape
Quectel Modules multiprotocoles NXP platform, SDIO Interface
Fiche technique
10004/12/2026 attendu
Min. : 1
Mult. : 1
: 1 000
2.4 GHz, 5 GHz SPI, UART, USB 3.14 V 3.46 V - 40 C + 85 C 12 mm x 12 mm x 2 mm BLE 5.4 802.11 a/b/g/n/ac/ax Reel, Cut Tape
Quectel Modules multiprotocoles Wi-Fi 6, dual band (2.4 GHz/5 GHz), BLE 5.3, ARM Cortex-M33, 260MHz, 1.2MB SRAM, 8MB Flash, Antenna: PCB, -40 85C, ultra-compact LCC + LGA package size of 25.5 x 18.0 x 3.16 mm
Fiche technique
10028/08/2026 attendu
Min. : 1
Mult. : 1
: 500
2.4 GHz, 5 GHz GPIO, I2C, JTAG, SPI, UART, USB 3.14 V 3.46 V - 40 C + 85 C PCB Antenna 25.5 mm x 18 mm x 3.16 mm Reel, Cut Tape
Telink Modules multiprotocoles Telink Semiconductor is a fabless IC design company of state-of-the art wireless connectivity SoCs. Through years of research and development, Telink has built a comprehensive product portfolio and become one of the world-leading IC suppliers in this
Fiche technique
Délai de livraison produit non stocké 6 Semaines
Min. : 1
Mult. : 1

ML7 2.4 GHz to 2.483 GHz 8.5 dBm I2C, SPI, UART 1.8 V 4.3 V - 40 C + 85 C 35.29 mm x 18 mm x 2.6 mm Reel
Telink Modules multiprotocoles The ML9118A module is designed based on Telink WiFi 6 multiprotocol SoC, the TLSR9118. It features WiFi 6 + Bluetooth 5.4, tailored for lowpower IoT applications.
Fiche technique
Délai de livraison produit non stocké 6 Semaines
Min. : 1
Mult. : 1

ML9118 I2C, SPI, QSPI, UART 3 V 3.6 V - 40 C + 105 C 18 mm x 25.5 mm x 3.1 mm BLE 802.11 b/g/n ANT, Thread, Zigbee