Abracon AISC SMD Ceramic Wire-Wound Chip Inductors
Abracon AISC SMD Ceramic Wire-Wound Chip Inductors are sized at 1.19mm x 0.51mm x 0.66mm with ceramic construction to assure the utmost thermal stability and high SRF. With exceptionally high Q compared to non-wirewound inductors (especially at high frequencies) and an operating temperature of -25°C to 85°C, the Abracon AISC SMD Ceramic Wire-Wound Chip Inductors offer inductance options from 1.0nH to 150nH. The AISC inductors are widely applied in VCO, SAW circuit for GSM, and CDMA communications and in hard disk, notebook computers, and other electronic equipment. The AISC series is available in case sizes 0402, 0603, 0805, 1008, 1206, 1210, 1210H, and 1812H.
Features
- Exceptionally high Q compared to non-wirewound inductors and high SRF
- Small sizes for surface mounting
- Low DCR and high rated current
- Epoxy coating to protect wound wire
Applications
- Mobile phones
- High-frequency communication circuits
- BLUETOOTH®, W-LAN, Broadband network
- VCO, SAW circuit for GSM, CDMA communications
Publié le: 2010-08-20
| Mis à jour le: 2023-09-11