Apacer Technology Inc. U-DIMM Memory Modules

Apacer U-DIMM Memory Modules offer a variety of different memory solutions to meet requirements for many different applications. These devices come in either Unbuffered DIMM (U-DIMM), Very Low Profile Unbuffered DIMM (VLP U-DIMM), ECC Unbuffered DIMM (ECC U-DIMM), VLP Mini ECC U-DIMM or Anti-Sulfuration U-DIMM. Each module type is designed to meet the specific needs of those applications.

U-DIMM (Unbuffered DIMM) is a JEDEC-compliant design applicable for desktop computers, industrial computers, and embedded systems. Manufactured with the highest quality original DRAM chips, stringently tested for quality assurance, and verified for compatibility, Apacer U-DIMMs are high-performance memory modules that are highly stable and compatible.

VLP U-DIMM (Very Low Profile Unbuffered DIMM) is a JEDEC-compliant design that measures only 0.72-inch in height, making it ideal for space-constraint systems, such as small-size industrial computers and embedded systems. Using VLP U-DIMM not only prevents mechanical issues, but the space saved may be used to improve heat dissipation, save energy, cut down business costs and improve system stability.

ECC U-DIMM (ECC Unbuffered DIMM) is a JEDEC-compliant module designed specifically for servers and workstations that require a highly stable operation. Manufactured with the highest quality original DRAM chips, it supports the ECC function to detect and correct data errors. These also have a built-in temperature-monitoring thermal sensor to prevent overheating and improve the memory module’s reliability.

VLP Mini ECC U-DIMM is a JEDEC-compliant design characterized by its small size, high performance, and high stability. Measuring only 82mm long and 18.8mm high, its compact size is especially applicable for space-constraint networking, communication, server, and embedded systems. It also supports ECC function to detect and correct data errors and a built-in temperature-monitoring thermal sensor to prevent overheating and improve the memory module’s reliability.

Anti-Sulfuration U-DIMM memory modules are mainly used in equipment exposed in a highly contaminated environment. This includes automobile, military, medical, transport, networking, and outdoor electronic products, and electronic equipment used in areas of high-concentration sulfur gas, e.g. volcanoes, hot springs, and mines. Airborne sulfur-containing particles can easily react with silver used in the electrode to form silver sulfide, which is non-conductive. As sulfuration increases, the resistance value increases, eventually causing an open circuit. To solve the problem of resistor sulfuration, Apacer has developed the world’s first anti-sulfuration memory module for use in a sulfur-rich environment, and this innovative design is now patented.

Specifications

  • U-DIMM Specifications
    • Memory Technology: DDR2, DDR3, DDR4
    • Frequency: 533/667/800 (DDR2), 1066/1333/1600/1866 (DDR3), 2133/2400/2666 (DDR4)
    • Density: 512M/1G/2G/4G (DDR2), 1G/2G/4G/8G/16G (DDR3), 2G/4G/8G/16G (DDR4)
    • Voltage: 1.8V (DDR2), 1.5V/1.35V (DDR3), 1.2V (DDR4)
    • Pin Count: 240-Pin (DDR2, DDR3), 288-Pin (DDR4)
    • Width: 64-Bit
    • PCB Height: 1.18" (DDR2, DDR3), 1.23" (DDR4)
    • Operation Temperature: TC=0°C to 85°C
  • VLP U-DIMMS Specifications
    • Memory Technology: DDR2, DDR3
    • Frequency: 533/667/800 (DDR2), 1066/1333/1600 (DDR3)
    • Density: 512M/1G/2G/4G (DDR2), 1G/2G/4G/8G (DDR3)
    • Voltage: 1.8V (DDR2), 1.5V/1.35V (DDR3)
    • Pin Count: 240-Pin
    • Width: 64-Bit
    • PCB Height: 0.72" (DDR2), 0.738" (DDR3)
    • Operation Temperature: TC=0°C to 85°C
  • ECC U-DIMM Specifications
    • Memory Technology: DDR4
    • Frequency: 2133/2400/2666
    • Density: 4G/8G/16G
    • Voltage: 1.2V
    • Pin Count: 288-Pin
    • Width: 72-Bit
    • PCB Height: 1.23"
    • Operation Temperature: TC=0°C to 85°C
  • VLP Mini ECC U-DIMM Specifications
    • Memory Technology: DDR3, DDR4
    • Frequency: 1066/1333/1600 (DDR3), 2133/2400 (DDR4)
    • Density: 1G/2G/4G (DDR3), 4G/8G/16G (DDR4)
    • Voltage: 1.5V/1.35V (DDR3), 1.2V (DDR4)
    • Pin Count: 244-Pin (DDR3), 288-Pin (DDR4)
    • Width: 72-Bit
    • PCB Height: 0.738"
    • Operation Temperature: TC=0°C to 85°C
  • Anti-Sulfuration U-DIMM Specifications
    • Memory Technology: DDR4
    • Frequency: 2133/2400
    • Density: 4G/8G/16G
    • Voltage: 1.2V
    • Pin Count: 288-Pin
    • Width: 72-Bit
    • PCB Height: 1.23"
    • Operation Temperature: TC=0°C to 85°C

Applications

  • Embedded and IPC
  • Gaming
  • Cloud computing
  • Healthcare
  • Transportation
  • Defense
Publié le: 2018-09-11 | Mis à jour le: 2023-08-31