Hirose Electric IT18 COM-HPC® Low-Profile BGA Mezzanine Connectors
Hirose Electric IT18 COM-HPC® Low-Profile BGA Mezzanine Connectors are advanced mezzanine connectors for next-generation COM-HPC embedded computing. These Hirose connectors offer stacking heights of 5mm and 10mm with an open pin field, providing designers with layout flexibility. A BGA pin-in-ball structure enhances mounting reliability, making the IT18 series ideal for embedded computing, servers, industrial automation, and medical imaging systems where space-saving, high-speed connectivity is critical.
Features
- COM-HPC standard-compatible mezzanine connector for next-gen embedded systems
- Supports PCIe Gen5 (32GT/s), Gen6 (64GT/s PAM4), and 100Gb (4 x 25Gb) Ethernet
- Ultra-fine 0.635mm pitch with 400 positions, delivering super high-density connectivity in compact board layouts
- Flexible 5mm and 10mm stacking heights with an open pin-field design, adaptable to a wide range of board layouts
- BGA ball attachment with pin-in-ball structure provides high mounting reliability
- Officially-licensed Samtec COM-HPC Connector
Applications
- Embedded computing
- Servers
- Defense/aerospace
- Industrial automation
- Medical imaging systems
Specifications
- 0.25A, 1.2A rated current
- 150VAC rated voltage
- 50mΩ maximum contact resistance
- 5000MΩ minimum insulation resistance
- -55°C to +125°C operating temperature range
Dimensions
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Publié le: 2026-05-28
| Mis à jour le: 2026-06-01