Infineon Technologies 750V HybridPACK™ Drive Modules
Infineon Technologies 750V HybridPACK™ Drive Modules are compact power modules optimized for hybrid and electric vehicle main inverter applications (xEV). The HybridPACK modules come with mechanical guiding elements, supporting easy assembly processes. The press-fit pins for the signal terminals avoid time-consuming selective solder processes, which provide cost savings on a system level and increase system reliability.
The lead type FS820R08A6P2B (820A/750V) is a six-pack module optimized for 150kW inverters. The power module implements the EDT2 IGBT chip generation, which is an automotive micro-pattern trench-field-stop cell design. The chipset has benchmark current density combined with short circuit ruggedness and increased blocking voltage for reliable inverter operation in harsh environments. The EDT2 IGBTs also show excellent light load power losses, which help to improve the system efficiency over a real driving cycle significantly. The chipset is ideal for switching frequencies in the 10kHz range.
The lead type FS820R08A6P2B has a pin-fin baseplate for optimized direct fluid cooling and high current density. The Wave product derivate (FS770R08A6P2x) offers optimized costs for fluid cooling with a ribbon-bond baseplate. The flat baseplate options of FS660R08A6P2Fx enable cost savings in instances where lower inverter performances are suitable. The performance FS950R08A6P2B introduces silicon nitride ceramic, resulting in the highest power rates within the HybridPACK Drive Module family.
Features
- Benchmark current density and improved light load power losses for extended EV driving ranges
- 750V EDT2 IGBT and diodes chipset for up to Tvj = 175°C switching operation
- Single-digit stray inductance and smooth, efficient switching behavior
- Extreme low conduction losses
- Short-circuit ruggedness up to Tvj = 175°C for reliable inverter operation under extreme conditions
- Press-fit signal pins
- Mechanical guiding elements for efficient and cost-saving inverter assembly
Applications
- Automotive
- Hybrid und battery electric vehicles (HEVs and EVs)
- Commercial, construction, and agriculture vehicles
Typical Appearance
Block Diagrams
Resources
Development Tools
NXP Semiconductors Conception de référence de pilote RDGD3160I3PH5EVB HP
Conception de référence d'onduleur triphasé, basée sur les pilotes de grille GD3160, conçue pour les modules IGBT Drive HP.