LeaderTech TGF Thermal Gap Filler Pads
LeaderTech TGF Thermal Gap Filler Pads are heat transfer media that conform to surface irregularities and adhere to a wide range of component shapes and sizes. These pads also adhere to recessed areas and protrusions. The pliable conformity of TGF pads is excellent for filling air gaps and minute variations. LeaderTech TGF Thermal Gap Filler Pads operate in a -60°C to +200°C continuous use temperature.
Features
- Silicone compound material
- -60°C to +200°C continuous use temperature
- UL 94V-0 flammability
- Up to 6.00W/m-K thermal conductivity
Thermal Impedance vs. Surface Contact
TGF Pad Diagram
Publié le: 2016-12-01
| Mis à jour le: 2023-03-16