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Molex GbX I-Trac Backplane Connector System

The GbX I-Trac Vertical Header Backplane Connector System achieves superior impedance control and 12.5Gbps data rates in high-bandwidth applications. The connectors feature a unique open pin-field design, offering flexibility to assign high-speed differential pairs, low-speed signals, and power/ground contacts anywhere within the pin field.

Features

  • Capable of supporting data rates of 12.5Gbps
  • Broadside-coupled, skew-equalized, differential pair system
  • Differential-pair density up to 69x pairs per linear inch using open-pin-field design
  • Quad PCB routing capability
  • Allows standard and orthogonal connections using the same parts
  • Integrated guidance
  • Bifurcated contact beams in a daughtercard interface

Applications

  • Data networking equipment
  • Servers
  • Storage systems
  • Telecommunication equipment
  • Hubs, switches, and routers
  • Central office, cellular infrastructure, and multi-platform services (DSL, cable data)
  • Medical equipment
  • Military/aerospace equipment

Specifications

  • 2x to 300x positions
  • 2x to 15x rows
  • 1.0A signal contact current rating
  • 1.0mΩ maximum contact to plated through-hole resistance
  • 750VRMS dielectric withstanding voltage
  • 1000MΩ minimum insulation resistance
  • 35.6N maximum contact insertion force per contact
  • 4.45N minimum contact retention force per contact
  • 0.69N maximum mating force per contact
  • 200x cycle durability
  • 1mm to 3.7mm pitch range
  • 1.60mm minimum PCB thickness range
  • UL 94V-0 rated liquid crystal polymer housing
  • High-performance copper (Cu) alloy contacts
  • Plating
    • 0.76μm minimum gold (Au) in the contact area
    • Tin (Sn) or tin/lead (Sn/Pb) in the solder tail area
    • Nickel (Ni) underplating
  • Press fit, Solder pin, or through-hole terminations
  • -55°C to +85°C operating temperature range

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Publié le: 2019-09-03 | Mis à jour le: 2025-03-13