Winbond NAND Product Portfolio
Winbond NAND Product Portfolio consists of Serial NAND, High-Performance Serial NAND, and SLC NAND Flash. The SLC NAND Parallel flash memories are offered in densities from 1GB through 4GB (16GB for QspiNAND memory) in JEDEC standard packages. SLC NAND is compliant with the ONFi standard. As an extension to the SpiNOR family, Winbond offers Serial NAND products in 1GB and 2GB densities with special features like continuous read. This facilitates fast data transfer between Flash and DRAM on system designs. The Serial NAND products have built-in ECC and bad block management, simplifying NAND management.
All the Flash products are available as KGD (Known Good Die). A family of Multi-Chip Package (MCP) NAND + DRAM products are also offered, ranging from 1GB through 4GB densities at 1.8V, primarily used in mobile and other applications. With AEC-Q100, TS16949, ISO9001/14001, OHSAS18001 qualifications, Flash memory products are available in industrial grade. Several are qualified for automotive grade. These products are used in computer, communication, consumer, mobile, automotive and industrial applications.
Related Memory Products
Winbond Portefeuille de produits NOR
Constitué de mémoires Flash NOR 1,2 V et en série, idéal pour les applications grand public et industrielles.
Winbond Serial MCP Flash Portfolio with SpiStack®
Based on the popular W25Q/W25N SpiFlash® series by stacking W25Q16JV and W25N01GV.
Winbond DRAM Product Portfolio
Mobile and Specialty DRAM for consumer, communication, industrial, and automobile markets.