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Xvisio SeerSense™ XR50 Module

Xvisio SeerSense™ XR50 Module offers a miniaturized, low-consumption design, 50mm baseline, and 75mm x 14mm x 8.9mm dimensions. The XR50 features an independent VSLAM computing unit, without host intervention, multiple working modes, and is easy to connect to AR/VR and robotic devices. Xvisio SeerSense XR50 Module is suitable for 3D scanning and reconstruction, depth sensing with OPENCV engine, factory automation, and drones.

Features

  • Independent VSLAM computing unit, without host intervention
  • Multiple working modes
  • USB 2.0 interface
  • BLUETOOTH® 5.0 adapter
  • Easy-to-connect design
  • Miniaturized, low-consumption design
  • Customizable for different baseline and ID requirement

Applications

  • AR/VR HDM
  • Service robots
  • Drones
  • AGV
  • Factory automation
  • 3D scanning and reconstruction
  • Depth sensing and OPENCV engine

Specifications

  • 50mm baseline
  • Passive stereo depth engine
  • <1.5W power consumption
  • 24-pin FPC - USB2.0, SPI, I2C, UART interface
  • 75mm x 14mm x 8.9mm dimensions
Publié le: 2022-11-16 | Mis à jour le: 2022-12-16