Texas Instruments ESDEVM Evaluation Module (EVM) allows the evaluation of most of TI's ESD portfolio. The board comes with all traditional ESD footprints to be able to test any number of devices. Devices that need to be tested can be soldered onto their respective footprint and then tested. For the typical high-speed ESD devices, an impedance-controlled layout is implemented to be able to take the S-parameter and de-embed the board trace. For the non-high-speed ESD diodes, footprints with traces going to test points are provided. These test points allow the user to easily run DC tests such as breakdown voltage, holding voltage, leakage, etc. The board layout also makes it easy to connect any of the device's pins to either power (VCC) or ground by shorting the signal pin to whichever the signal is.
Features
Allows testing of most TI ESD devices
Many footprints to allow testing of each part
S-parameter testing for signal integrity
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