TE Connectivity / ERNI MicroSpeed Triple High-Speed Connectors
TE Connectivity's ERNI MicroSpeed Triple High-Speed Connectors are ideally suited for next-generation communication standards such as Next Generation Ethernet 100Gbit/s (IEEE 802.3ba), optical internetworking forum (OIF), and the Internet of Things (loT). These shielded, high-density connectors utilize three rows to enable data rates of up to 25Gbit/s. They have SMT terminals that provide a high contact density with 3 x 25 positions in a 1mm pitch. Applications for TE Connectivity's ERNI MicroSpeed Triple High-Speed Connectors include data communication and telecommunication, high-end computing, medical technology, and industrial automation.
Features
- Three rows
- Data rates up to 25Gbit/s
- 75-pin variant
- 1.0mm pitch
- 5mm board-to-board distance
- Robust blind-mate design for industrial requirements
- Improved shielding concept for high EMC protection
- 50Ω/100Ω impedance matched
- SMT terminals
- Maximum grounding and routing flexibility: transversal, longitudinal or meshed assignments
- Single-ended or differential pair signaling
- Triple-row design supports crosstalk reduction (NEXT, FEXT) of up to 90% for certain patterns
- Low inductance path to ground
Applications
- Data communication and telecommunication
- High-end computing
- Medical technology
- Industrial automation
Related Products
TE Connectivity / ERNI MicroSpeed & MicroSpeed Power Connectors
High-speed performance with excellent signal integrity, ideal for next-generation communication.
Publié le: 2015-09-02
| Mis à jour le: 2023-04-20